Mr. Liu Zhiquan, Chinese nationality, without right of residence outside China, born in 1970, Doctor of Engineering. After graduating with a Ph.D. in 2000, he went abroad to study. At the end of 2006, he returned to work as an overseas scholar. From December 2006 to March 2019, he served as a researcher and innovation project leader of the Institute of Metal Research, Chinese Academy of Sciences, and a doctoral supervisor at the University of Chinese Academy of Sciences and the University of Science and Technology of China; since March 2019, he has been a researcher and researcher at the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences Team leader, doctoral supervisor of University of Chinese Academy of Sciences. He has long been engaged in the microstructure characterization and in-situ preparation of performance-related material structures and functions, focusing on the microstructure, performance and service reliability of metal electronic packaging materials and packaging structures.