On 19 May 2016, the Official Journal of the European Union officially published Directive (EU) 2016/774 to amend exemption list of Annex II to Directive 2000/53/EC (ELV). This revision refers to item as follows: Exemptions 8(e), 8(f), 8(g), 8(h), 8(j) and 10 (d). This Directive shall enter into force on the twentieth day following that of its publication in the Official Journal of the European Union. Member States shall adopt and publish, within six months of its publication in the Official Journal of the European Union at the latest, the laws, regulations and administrative provisions necessary to comply with this Directive.
Requirements of Regulations
Annex II to Directive 2000/53/EC lists vehicle materials and components exempted from the prohibition set out in Article 4(2)(a) thereof. Exemptions 8(e), 8(f), 8(g), 8(h), 8(j) and 10 (d) of Annex II shall be reviewed in 2014. An assessment of technical and scientific progress has demonstrated that the use of lead in the applications covered by exemptions 8(h), 8(j) and 10(d) should not be prolonged because the use of lead in these applications has become avoidable. The assessment of technical and scientific progress has also demonstrated that the use of lead in the applications covered by exemptions 8(e), 8(f) and 8(g) remains unavoidable as substitutes have not become available yet. However, since information exists on possible future lead substitutes in these applications, it is appropriate to introduce a review date allowing to establish if the use of lead in these applications can be discontinued. These exemptions shall be reviewed in 2019.
|
Item |
Exemption |
Scope and expiry date of the exemption/ Review date |
|
8（e) |
Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) |
This exemption shall be reviewed in 2019 |
|
8(f) (a) |
Lead in compliant pin connector systems |
Vehicles type-approved before 1 January 2017 and spare parts for these vehicles |
|
8(f) (b) |
Lead in compliant pin connector systems other than the mating area of vehicle harness connectors |
This exemption shall be reviewed in 2019 |
|
8(g) |
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages |
This exemption shall be reviewed in 2019 |
|
8(h) |
Lead in solder to attach heat spreaders to the heat sink in power semiconductor assemblies with a chip size of at least 1 cm2 of projection area and a nominal current density of at least 1 A/mm2 of silicon chip area |
Vehicles type-approved before 1 January 2016 and spare parts for these vehicles |
|
8(j) |
Lead in solders for soldering of laminated glazing |
Vehicles type-approved before 1 January 2020 and spare parts for these vehicles |
|
10(d) |
Lead in the dielectric ceramic materials of capacitors |
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